GDSI, Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California.
No. Item: Maker: Model: Vintage: Condition: Quantity: Download: 1: Semi-auto Dicing Saw: Disco: 2H6: 1994: Working condition: 1: 2: Semi-auto Dicing Saw: Disco ...
Best Equipment for advanced Dicing-Grinding Service. DISCO's high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO's precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.
May 14, 2018· DUBLIN--(BUSINESS WIRE)--The "Global Semiconductor Wafer Polishing and Grinding Equipment Market - Segmented by Equipment, End User, and Geography - Growth, Trends, and Forecast (2018 - 2023 ...
Poligrind is performed by Disco's ultra-fine diamond abrasive tools. Compared to standard grinding, Poligrind delivers superior performance regarding die strength as well as excellent post-grinding surface condition. At the same time, Poligrind is a non-chemical stress-relief process, which has reduced environmental impact.
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment…
servicing disco grinding equipment. taiko grinding process – Grinding Mill China. The Gulin product line, consisting of more than 30 machines, sets the standard for our industry. We plan to help you meet your needs with our equipment, with our distribution and product support system, and the continual introduction and updating of products. ...
GDSI Full/Partial Wafer Grinding. A long list of engineering achievement allows customers to recover from process mistakes or wafer breakage. GDSI's capabilities allow for yield recovery by grinding partial wafers or engineering development and die characterization by thinning at the die level.
Nov 24, 2017· Dicing before grinding DBG Dicing-Grinding Sevice DISCO HI-TEC Europe
Hard Disk Grinding Machine: 5 Steps (with Pictures) Gracias por el Instructable, lo hice con un disco antiguo y luego de unos segundos (vara entre 15 a 45 segundos) se detiene el disco, y para que vuelva a girar se debe desconectar y conectar nuevamente.
Products/Services for Disco Back Grinding Machines Grinders and Grinding Machines - (975 companies) Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish.
Jul 19, 2009· You can find more Taiwan Surface Grinder, Grinding Machine, CNC Universal Cylindrical Grinder, CNC Universal Cylindrical Grinding Machine and Universal Cylin...
DISCO HOME > Customer Support > Trouble Shooting and FAQs for DISCO Equipment: ... We have provided answers to various questions that may arise when using DISCO equipment, and the proper measures when you feel that a problem has occurred. 3000/6000 series ... Training Services. Trouble Shooting and FAQs for DISCO Equipment.
Basics of Grinding Fundamental Manufacturing Processes Video Series Study Guide - 3 - different internal contours can be produced within a workpiece using I.D. grinding. In centerless grinding, the workpiece rotates between a grinding wheel and a regulating drive wheel. The work is supported from below by a fixed work-rest blade.
This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.
Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.
Stump Grinders. With quality construction, operator safety features and a user-friendly design, Dosko's walk behind stump grinders are made to meet your tree care needs. Narrow widths ensure transport ease and a unique side discharge frame keeps cuttings away from the machine while grinding.
Precision Backgrind & Wafer Thinning Services. We use fully-automated Disco and Strasbaugh wafer backgrinding equipment to achieve the highest possible level of quality and can continuously achieve thin wafer target thicknesses to less than 0.050mm (0.002").
Grinding Machine Manufacturer Local Sales & Service Leading grinding machine manufacturers around the world rely on Koyo grinding machine tools and apparatus for high-tolerance precision grinding. Using high-quality materials and tooling, we custom engineer our surface grinders to meet your mass production specifications.
Fully Automatic In-Feed Surface Grinder Advanced thinning power for large wafers Grinder of choice The DFG8540/8560 improves upon the functionality and performance that made the DISCO 800 series the grinder of choice at facilities around the world. Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield for
Buehler's sectioning, mounting, grinding and polishing, imaging and analysis and hardness testing metallographic equipment along with consumables are used by metallurgical, metallography, petrography, research & development, university laboratories, quality control departments and failure analysis facilities for the analysis of all types of ...
Nov 14, 2013· 70+ channels, more of your favorite shows, & unlimited DVR storage space all in one great price.
The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. The newly developed high-rigidity, low-vibration spindle achieves superior grinding . results and is capable of in-feed grinding and creep feed grinding (option).
Discotom-100 with fixed table Automatic cut-off machine with variable spindle speed and variable automatic feed. 4.0 kW motor. For 300 mm (12") cut-off wheels. Cutting table with 10 mm T-slots. Recirculation Cooling Unit and clamping tools are ordered separately. Optional table unit can be used. Discotom-100 with automatic X-table
DISCO HI-TEC EUROPE . Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]
Leading-edge CMP, wafer thinning and wafer polishing solutions.
View our other machines and our partners' products. Recycling, separator, cleaning, planarization. ... Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 ... DISCO HI-TEC EUROPE . Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany.
1. Grooving: Method that forms two narrow grooves in the dicing street, removes only the film formed on the pattern, and conducts full cut dicing between them using the laser.
Gracias por el Instructable, lo hice con un disco antiguo y luego de unos segundos (varía entre 15 a 45 segundos) se detiene el disco, y para que vuelva a girar se debe desconectar y conectar nuevamente. Probé con otro y sucede lo mismo, también probé con 2 fuentes de alimentación distintas y lo mismo.
GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing from brokers and refurbishers it was obvious that there was a need for a company who really understood the definitions of refurbishment, service, quality and integrity.